Applications
The sinter bonder fulfills pre-sintering die bonding requirements of power semiconductors. With bond head featuring high force and high temperature capabilities, it ensures reliable die attaching, satisfying various application demands from sintering production processes.
Features
Dual-drive gantry structure with high accuracy
Multifunctional platform, supporting die bonding processes of IGBT, SiC, etc.
Accommodates silver paste and silver film processes
Optimized for copper sintering applications
Bond force range: 0.5N~300N (500N optional)
Heating temperature (bond head and bond stage) up to 200°C
UPH up to 1.8K
Compatible with bonding of SiC, DTS, NTC, Clip, etc.
SECS/GEM compliant
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