Bonding Processes
Adhesive, Eutectic, Flip chip.
Applications
Optical Communications, RFIC/MMIC, Semiconductor Lasers, MEMS, LiDAR, Military, Aerospace, Healthcare.
Features
Fully automatic, multi-functional
Supports automatic handling for various material: wafers, waffle/gel pack, tape feeders, magazines
Compatible with different bonding processes: dispensing, dipping, eutectic, flip-chip
Bond force range: 5g-2000g
High-precision mode: ±5μm@3sigma
Supports automatic exchange of die collets
SECS/GEM complaint
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