Applications
The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, capable to effectively remove the surface contaminants of organics and oxides from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. The system possesses a large-capacity chamber and advancedly-designed electrodes, combing high-uniformity cleaning and production efficiency.
Features
Outstanding clean result & reliable performance
High capacity: Max 16 magazines loading capacity
Superior vacuum performance with oil pump + booster pump
Slim structure with pump built-in
Advanced electrode design & excellent uniformity
Intuitive graphical user interface
Specifications
Plasma Frequency | 13.56MHz (radio frequency) |
Plasma Power | Standard 600W (1000W as option) |
Electrodes Number | 2 |
Chamber Size | W580mm x D580mm x H530mm (Approx. 170L) |
Chamber Capacity | Max. 16 magazines |
Vacuum Pump | Oil pump with booster pump, built-in type |
Chamber Vacuum | Better than 5Pa |
Vacuum Gauge | Pirani or capacitance manometer |
Mass Flow Controllers | One as standard (Max three optional), flow rate 100sccm |
Control System | Windows based touchscreen IPC + PLC control, supporting manual and automatic operation, process recipe program editing/storage/execution, and automatic process data recording and display. Supports MES system. |
Enclosure Dimension | W1200mm x D1000mm x H1850mm (tower lamp excluded) |
Weight | Approx. 800Kg |
Power Supply | 380V, 3P+N+PE, 50Hz, 6kW |
Vent Gas | N2, 0.1-0.15MPa |
Process Gas | Ar, Ar/H2 forming gas, O2, etc., 0.15-0.2MPa |
CDA | 0.5-0.6MPa |
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