High-reliability Semiconductor
Packaging Equipment

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High-Precision Die Bonder

Combined with advanced technology and mature processes,
it enables high-speed and high-precision die bonding,
that meets customers' diverse application requirements.

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Nano-Silver Sintering System

The key equipment for SiC packaging to achieve reliable pressure sintering
process for nanomaterials.

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Plasma Cleaning System

Applied to cleaning and surface activation prior to semiconductor packaging
process such as die bonding, wire bonding, underfill, molding, etc., capable
to effectively enhance the bonding strength, thus significantly
improving the process yield.

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Vacuum Solder Reflow Oven

Advanced process system enhanced by microwave plasma
High performance vacuum reflow soldering due to highly efficient deoxidation.

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Light leads the future
Wisdom brings mutual benefit

Opto-Intel Technologies Co., Ltd., headquartered in Chongqing, China, is a semiconductor assembly equipment manufacturer integrating R&D, manufacturing, and sales to provide professional services to the domestic and global markets.

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公司环境

HONOR

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COMPANY PHILOSOPHY

工厂设备

TEAM

创新团队

Products & Solutions

  • Vacuum Soldering Reflow Technology

    By forming a vacuum environment, the bubbles in the molten solder liquid are discharged smoothly, so as to achieve high quality cavity-free brazing, and the inert, reducing atmosphere and leading microwave plasma auxiliary technology are used to improve the soldering quality. The technology can realize high strength soldering, has good soldering form control ability, has the characteristics of efficient and reliable, flexible process, stable and repeatable, widely used in semiconductor laser, optical communication module, microwave T/R components, power chip packaging and other fields.
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  • Microwave Plasma Cleaning Technology

    Treat the surface of the material through the plasma excited by the microwave electromagnetic wave, to achieve strong deoxidation and activation, ensure the cleanliness of the material surface, and improve the infiltration. This technology can provide a good foundation for the next process, and can greatly improve the reliability of packaging, with the characteristics of high efficiency, no damage, no pollution, low process temperature. Its main application on micro treatment with material surface, including decontamination, activation, modification, deoxidation, etching, descum and deposition, etc.
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  • Die Bonding Technology

    Die bonding, is the core step in semiconductor packaging, to precisely bonding diced dies onto substrates via high-precision equipment to achieve electrical and mechanical connections. Opto-Intel independently developed the die bonding technology integrated submicron-level visual alignment (precision ≤1μm), multi-process adaptability (adhesion/eutectic/pre-sintering), and intelligent real-time compensation systems. It addresses industry challenges such as ultra-thin chip fragility and thermal stress matching, enabling reliable packaging for high-value-added devices including IC chips, power modules (SiC/IGBT), optoelectronic communication chips, Micro/Mini LEDs, RF/microwave modules, and MEMS sensors.
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    • Precision Die Bonder

    Precision Die Bonder

    Silver Sintering System

    Silver Sintering System

    Plasma Cleaning System

    Plasma Cleaning System

    Plasma Ashing System

    Plasma Ashing System

    Vacuum Solder Reflow Oven

    Vacuum Solder Reflow Oven

    NEWS

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