High-reliability Semiconductor
Packaging Equipment

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Sinter bonder

Capable of high-quality pre-applied SiC dies to meet the requirements
of the subsequent silver sintering process and achieve high-reliability
SiC packaging.

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Nano-Silver Sintering System

The key equipment for SiC packaging to achieve reliable pressure sintering
process for nanomaterials.

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Microwave Plasma System

Main application on micro treatment with material surface, including decontamination,
activation, modification, deoxidation, etching, descum and deposition, etc.

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Vacuum Solder Reflow Oven

Advanced process system enhanced by microwave plasma High performance
vacuum reflow soldering due to highly efficient deoxidation

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Optoelectronics leads the future
Wisdom brings mutual benefit

Opto-Intel Technologies Co., Ltd., headquartered in Chongqing, China, is a semiconductor assembly equipment manufacturer integrating R&D, manufacturing, and sales to provide professional services to the domestic and global markets.

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WORK ENVIRONMENT

公司环境

HONOR

资质荣誉

COMPANY PHILOSOPHY

工厂设备

TEAM

创新团队

Products & Solutions

  • Vacuum Soldering Reflow Technology

    By forming a vacuum environment, the bubbles in the molten solder liquid are discharged smoothly, so as to achieve high quality cavity-free brazing, and the inert, reducing atmosphere and leading microwave plasma auxiliary technology are used to improve the soldering quality. The technology can realize high strength soldering, has good soldering form control ability, has the characteristics of efficient and reliable, flexible process, stable and repeatable, widely used in semiconductor laser, optical communication module, microwave T/R components, power chip packaging and other fields.
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  • Microwave Plasma Cleaning Technology

    Treat the surface of the material through the plasma excited by the microwave electromagnetic wave, to achieve strong deoxidation and activation, ensure the cleanliness of the material surface, and improve the infiltration. This technology can provide a good foundation for the next process, and can greatly improve the reliability of packaging, with the characteristics of high efficiency, no damage, no pollution, low process temperature. Its main application on micro treatment with material surface, including decontamination, activation, modification, deoxidation, etching, descum and deposition, etc.
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    • MWD 80

    真空微波等离子清洗机

    MWD 12

    真空微波等离子清洗机

    VSR-20MPA

    真空共晶焊炉

    GBA series

    惰性气体手套箱

    NEWS

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