Product overview：
AMP-20SA can effectively remove organic pollutants and natural oxide layers from the surface of materials, activate the surface of the material, enhance the quality of bonding and welding, and will not cause physical bombardment damage to the materials.
Applications: Primarily used for cleaning in the packaging process of ICs, IGBTs, optoelectronics, MEMS devices to improve the quality of soldering and bonding. It can also be used for photoresist removal and polymer surface activation.
Features：
High-density plasma
No physical damage
Ultra short cleaning time
Strong antioxidant effect
High uniformity cleaning effect
Support automated production (optional)
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