Mainly used for SiC dies packaging process.
Capable of high-quality pre-applied SiC dies to meet the requirements of the subsequent silver sintering process and achieve high-reliability SiC packaging.
Features:
Multi-purpose: Power device (IGBT, SiC) and optical module bonding
Support pre-bonding of dry or wet sinter paste process
Support pre-bonding of sinter film process
Bond force capability up to 300N (500N Optional) and process heat profiles up to 200 ℃
Support 0~360° rotatory bonding.
Supports bonding of multiple materials:
SIC, DTS, NTC, Clip, etc.
Support high-precision mode:+-5um@3 sigma
Support high-speed mode: 1.8K(+-12.5um）
Support secs-gem
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