Applications
The equipment features high-speed eutectic bonding capability especially for high-power LED, and provides effective inert gas protection. It incorporates the rotary transfer stage and pick arm to fulfill high-precision bonding requirements.
Features
High Throughput (UPH up to 5K)
Cold picking & hot bonding, achieving precise control of bond force and temperature
Inert gas protection
Automatic material handling: wafers, waffle pack, magazines
Bond force range: 30g-1000g
Placement precision: ±15μm@3sigma
SECS/GEM complaint
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