Technical advantages: Mainly used to achieve void-free and perfect solder joints between high-power chip/device and its substrate. Process capability includes vacuum, inert or reducing atmosphere and our unique plasma enhanced technology to optimize soldering quality.
Product overview：
Classic proven system design
Powered by formic acid assistance technology
PLC control system with Windows-based computer interface
Applications: Void free soldering for diode laser, optical communication device, high power chip packaging.
Features:
Rapid and precise temperature control
Formic acid process for low-T solder application
Automatic gas flow control with MFC
Custom direct-heated tooling fixture plate
Easy-to-use GUI
Options:
Vacuum pump
Additional gas lines
Various deoxidation modules
Custom heating plate
Extra monitor T/Cs
Water chiller
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