Technical advantages: Mainly used to achieve void-free and perfect solder joints between high power chip/device and its substrate.Process capability includes vacuum,inert or reducing atmosphere and ourunique plasma enhanced technology to optimize soldering quality.
Product overview：
Industry-leading technology of microwave plasma enhanced soldering
High performance vacuum reflow soldering due to highly efficient deoxidation
PLC control system with Windows-based computer interface
Applications: Void free soldering for diode laser, optical communication device, high power chip packaging.
Features:
Void-free vacuum reflow soldering
Deaxidation assisted by MW plasma
Non-damage plasma technology
Perfect for low temperature solder process
Rapid and precise temperature control
Easy-to-use GUI
Options:
Vacuum pumg
Additional gas lines
Custom heating plate
Various deaxidation modules
Extra monitor T/Cs
Water chiller
Soft start and slow vent
简体中文
