From September 11th to 13th, 2024, the 25th China International Optoelectronic Exposition successfully drew to a close after three days. This exposition was unprecedented in scale, attracting over 3,700 high-quality optoelectronic enterprises from around the world to gather and numerous professionals to visit and exchange ideas, promoting the development of the global optoelectronic industry. opto-intel made its debut at Booth 10A39 in Hall 10, the Semiconductor and Optical Communication Intelligent Equipment Hall.
During the exhibition, opto-intel showcased its latest silicon carbide chip packaging equipment—the Precision Automatic Die Bonder and the nano-silver sintering system. It also exhibited multiple models of microwave plasma cleaning systems equipped with mature technology and upgraded vacuum solder reflow ovens.
The Precision Automatic Die Bonder, independently developed and manufactured by opto-intel, has become a key tool for high-reliability silicon carbide chip packaging due to its high precision, fast efficiency, and easy operation.
Now In the semiconductor industry, silicon carbide devices have gradually become star devices in the field of power electronics due to their excellent performance at high temperatures, high pressures, and high frequencies. However, due to the difficulty of packaging, traditional packaging materials and processes have been unable to meet actual packaging demands, resulting in stricter requirements in multiple areas such as packaging materials, processes, and equipment.
Silicon carbide chip packaging places strict requirements on die-bonding equipment, including high precision, precise control of large pressures, compatibility with multiple materials, high-efficiency automation, and temperature control management. The equipment needs to have micron-level placement accuracy because any slight error can affect packaging quality and lead to a decline in chip performance. Only precise positioning can avoid stress or connection errors. The equipment must also be able to flexibly adapt to different packaging materials (such as handling high thermal conductivity materials like nano-silver, nano-copper, or ceramics) and ensure precise control of pressure during the packaging process, ensuring a reliable connection between the chip and the substrate without causing the silicon carbide chip to shift under high pressure. Additionally, due to its high power density, silicon carbide chips are very sensitive to operating temperatures. Stable temperature control and good thermal management also play a crucial role in ensuring chip performance and packaging reliability.
The emergence of opto-intel's Precision Automatic Die Bonder ND1800 has not only effectively improved the quality and reliability of chip packaging but also injected new technological momentum into upstream and downstream industries in the supply chain. Besides applications in silicon carbide packaging, this equipment can also be used in fields such as IGBT, optical communications, and LED.
Another piece of equipment exhibited by opto-intel, the nano-silver sintering system, also attracted widespread attention. Breakthroughs in silicon carbide chip packaging technology cannot be achieved without the support of high-temperature, high thermal conductivity materials. Nano-silver materials have become an ideal choice for silicon carbide chip packaging due to their superior thermal and electrical conductivity.
Compared to traditional materials used for packaging, nano-silver sintering technology offers excellent fatigue resistance and thermal stability, ensuring the stable operation of chips in extreme environments for extended periods.
Currently, silicon carbide chip packaging equipment mainly depends on imports, which restricts the development of the domestic semiconductor industry. opto-intel's nano-silver sintering system provides domestic enterprises with a reliable alternative to imports, promoting the independent research and development process of key equipment.
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